Streamline Composite Formulation and Production

Enhance composite materials from precure to final cured composite
Optimize Composite Formulations Maximize Composite Performance Optimize Resin to Filler Ratios

Combine the DSC 250 and DMA 850 to:

  • Bridge the gap between formulation changes and their impact on final composite product performance
  • Quantify formulation impacts on the cured composite’s
    • Cure Strength
    • Flexibility
    • Adequate end use temperature ranges


Differential Scanning Calorimeters (DSC) measure temperatures and heat flows associated with thermal transitions in a material. Common usage includes investigation, selection, comparison and end-use performance evaluation of materials in research, quality control and production applications. Properties measured by TA Instruments’ DSC techniques include glass transitions, “cold” crystallization, phase changes, melting, crystallization, product stability, cure / cure kinetics, and oxidative stability.

Temperature Range: -180°C to 725°C

Detectable Information: Glass transitions, melting, crystallization, phase changes, heat capacity, cure kinetics, oxidative induction time

A rotational rheometer is used to measure viscosity (eta) and viscoelasticity (G’, G” and Tan delta) properties of a material. Rheometers can handle all kinds of samples from low viscosity liquids (e.g. water or solvents), semi-solid or soft gels, to high stiffness and high modulus solids. A rotational rheometer can perform flow measurements to test the viscosity of a liquid as a function of time, temperature shear rate or shear stress. Flow tests can also be used to measure the yield stress and thixotropic properties of a structured fluids. The rheometer can also perform dynamic oscillatory measurements to measure the viscoelastic properties of a semi-solid or solid sample. Typical oscillation tests are used to verify the linear viscoelastic region; monitor thermoset curing or sample stability; quantify differences in different formulations; measure polymer melts to compare differences in their molecular weight and molecular weight distribution; measure sample modulus and elasticity change as a function of time and temperature; measure glass transition (Tg) and sub-ambient transitions of polymers or polymer blends. In addition, a rotational rheometer can also perform transient type of measurements to study creep-recovery and stress relaxation.

Temperature Range: -150°C to 600°C

Detectable Information: viscosity, yield stress, thixotropy, curing, modulus (G’, G” G*), damping factor (tan delta), glass transitions, sub-ambient transitions, stress relaxation, creep-recovery

Dynamic Mechanical Analysis measures the mechanical properties of materials as a function of time, temperature, and frequency. In addition to basic material properties, DMA also quantifies finished part characteristics, reflecting the important contribution that processing has on end-use performance. DMA is commonly used to measure glass transition temperatures and secondary transitions, orientation caused by processing, cold crystallization and effect of crystallinity on mechanical properties, cure optimization, filler effects in composites, and much more. DMA provides an accurate measure of material strength (modulus) but also other important mechanical properties such as damping, creep, and stress relaxation.

Temperature Range: -150°C to 600°C

Detectable Information: Glass transition temperature (Tg), secondary transitions, modulus, viscoelasticity (storage modulus, loss modulus, tan delta), creep and creep compliance, stress relaxation, shrinkage and shrinkage forces

Thermogravimetric Analyzers measures temperatures and weight changes associated transitions in a material. Common usage includes decomposition, volatilization, residue, material composition analysis, decomposition kinetics, thermal and oxidative stabilities.

Temperature Range: 30°C to 1200°C

Detectable Information: weight change temperature, weight change amount, decomposition kinetics, residue.

Utilize the TGA to accurately measure composite composition

  • Determine filler content and concentration during formulation to predict product performance
  • Verify that the resin and filler work together to form effective products
  • Determine degradation temperature in final products especially for applications requiring elevated temperatures
  • When combined with EGA, TGA can measure off-gas components to prevent hazardous health concerns upon decomposition





Technology

Design Production Conditions to Maximize Product Performance


Easily study the effects of formulation changes on cure reaction kinetics, working time, and product performance

Changes to resin formulation through concentration changes and ingredient swapping have a direct impact on the curing kinetics, working time, and performance of the cured composite. Quantifying the impact of the changes is easily accomplished with measurements on the DSC 250. Save time and money by utilizing this information to tailor the reaction kinetics and predict product performance, thereby streamlining product development.






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Optimize Formulations for Efficient Production and Enhanced Performance


Easily quantify the effects of formulation changes on cure reaction kinetics and working time

Tracking the cure reaction in real-time allows you to clearly pinpoint the minimum viscosity and gel point with confidence. The Discovery Hybrid Rheometer’s low torque performance delivers accurate data from beginning to end of your cure experiment. Complement your rheology measurements with cure reaction kinetics from the best performing DSC for complete resin characterization.

Combine the DSC and HR 30 to:
  • Characterize resins
  • Quantify cure strength
  • Measure residual cure
  • Optimize molding conditions and cycle times
  • Test solids with the HR 30’s fully integrated DMA capabilities
  • Identify adequate end use temperature ranges






Optimize Resin to Filler Ratios to Maximize Product Performance


The DSC maximizes product performance

  • Quantify the effects of formulation changes on cure reaction kinetics or curing temperature
  • Capture cure temperature reaction kinetics to tailor cure conditions and formulation during R&D
  • Determine residual cure during QA/QC to prevent product failure




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