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Accurately measure CTE of materials and test material compatibility.

Determine the potential for delamination of layered materials through measurement of the CTE of the various layers. Material compatibility can easily be determined.

Easily measure multi-layer material thicknesses and gain critical information about the properties of each layer or the entire sample.

The TMA, with the penetration probe, can easily measure the thickness of layers in a multi-layered sample and the DSC can provide information such as glass transition temperatures and heat capacity of the samples.

Differential Scanning Calorimeters (DSC) measure temperatures and heat flows associated with thermal transitions in a material. Common usage includes investigation, selection, comparison and end-use performance evaluation of materials in research, quality control and production applications. Properties measured by TA Instruments’ DSC techniques include glass transitions, “cold” crystallization, phase changes, melting, crystallization, product stability, cure / cure kinetics, and oxidative stability.

Temperature Range: -180°C to 725°C

Detectable Information: Glass transitions, melting, crystallization, phase changes, heat capacity, cure kinetics, oxidative induction time

Thermomechanical Analyzers (TMA) measure changes in the dimensions of a sample as a function of time, temperature, and force in a controlled atmosphere.

Properties measured by TMA include the material’s coefficient of linear thermal expansion (CTE), shrinkage, softening, and glass transition temperatures. Modulated TMA (MTMA) can be used for deconvolution of the Total dimension change signal into Reversing and Non-Reversing dimension change signals for separating expansion from contraction, shrinkage, and stress relaxation.

Temperature Range: -150°C to 1000°C

Detectable Information: Coefficient of Thermal Expansion (CTE), sample expansion and contraction, softening points, glass transition temperatures, and delamination.


How the DSC and TMA together will benefit your lab:

Determine cure state and glass transitions of adhesives.

Measure the glass transition temperature and extent of cure of adhesives used to hold components in place on printed circuit boards. TMA is extremely sensitive to the multiple Tgs that may exist on a PCB. DSC can quickly capture any residual cure of epoxy components.

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Learn how the instrument package below will optimize your product development by providing crucial information on material compatibility, cure states, glass transitions, and more.

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