Characterize Electronics from Material Selection to End-Use

Optimize product development with crucial data on electronics performance and safety
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Test material compatibility and stability

Easily determine material compatibility, especially as materials change in response to heat or humidity. TMA helps you predict delamination of layered materials through measurement of the CTE of the various layers.

Obtain crucial data for printed circuit boards

Measure the glass transition temperature and extent of cure of adhesives used to hold components in place on printed circuit boards. TMA is extremely sensitive to the multiple Tgs that may exist on a PCB. DSC can quickly capture any residual cure of epoxy components, ensuring the cure is complete.

Easily measure multi-layer material properties

The TMA, with the penetration probe, can easily measure the thickness of layers in a multi-layered sample under humid or dry conditions. DSC can provide information such as glass transition temperatures and heat capacity of the samples. Together, these techniques help you develop high-quality materials and products to perform under a wider range of conditions.


Differential Scanning Calorimeters (DSC) measure temperatures and heat flows associated with thermal transitions in a material. Common usage includes investigation, selection, comparison and end-use performance evaluation of materials in research, quality control and production applications. Properties measured by TA Instruments’ DSC techniques include glass transitions, “cold” crystallization, phase changes, melting, crystallization, product stability, cure / cure kinetics, and oxidative stability.

Temperature Range: -180°C to 725°C

Detectable Information: Glass transitions, melting, crystallization, phase changes, heat capacity, cure kinetics, oxidative induction time

Thermomechanical Analyzers (TMA) measure changes in the dimensions of a sample as a function of time, temperature, and force in a controlled atmosphere.

Properties measured by TMA include the material’s coefficient of linear thermal expansion (CTE), shrinkage, softening, and glass transition temperatures. Modulated TMA (MTMA) can be used for deconvolution of the Total dimension change signal into Reversing and Non-Reversing dimension change signals for separating expansion from contraction, shrinkage, and stress relaxation.

Temperature Range: -150°C to 1000°C

Detectable Information: Coefficient of Thermal Expansion (CTE), sample expansion and contraction, softening points, glass transition temperatures, and delamination.




Technology

Data-Informed Electronics, Designed for All Environments


As electronic devices become smaller and thinner, the impact of temperature or humidity on thin films or multi-layer packages will become more prominent. Materials’ resulting expansion or contraction can lead to delamination between layers or incompatible fit of parts under extreme conditions.

Understanding material changes under extreme conditions is important to guide material selection, development, and production. Differential Scanning Calorimetry (DSC) and Thermomechanical Analysis (TMA) including humidity analysis (TMA RH) offer valuable information about all electronic materials and components so products can be designed to withstand challenging conditions.




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